Source: SaiDiWang

Editor's note: mobile multimedia broadcasting, digital TV, 3 g communications, automotive electronics, and other emerging areas not only for the future development of the integrated circuit provides a broad market space, but also for IC enterprises to provide better, faster, more high performance, low power consumption, low cost of products, in order to meet the new market demand. Held a few days ago Beijing international symposium on microelectronics, industry experts the IC design, the manufacture, the packaging of the new technology, new methods and new trend and development and construction industry to carry on the thorough discussion.

The United States pericom company general manager ChenShaoMin:

Technology innovation cost are improving

FengXiaoWei

Since the invention from the integrated circuit, and its application on the market at different times by different products in dominated. In the 1980 s, before the application of large computer integrated circuit is the main driving factors; In the 80 s, with the rapid popularization of personal computer, personal computer chips in integrated circuit market occupies the most important position; After the 1990 s, although personal computers remain the trend of the development, but its growth speed but inferior in digital consumer products. 2006 years of statistics data show that the annual global consumer product market value of $145.7 billion, which accounts for the proportion of IC market compared with 2003 more than doubled.

And the product price decline contrast the rising cost of innovation. In order to design cost, for example, when printing precision of 0.5 microns, a mask for the cost of $10000 to $13000, while between technological progress to 90 nm, after the following a mask will cost up to more than $1 million. Research and development cost in the total cost and the proportion of is rising year by year, in 1998, integrated circuit product research and development expenditure to total cost 12.2%, to 2006 the data growth to 16%, it is estimated that by 2012 will rise to 20.2%. Along with the technology promotion, the factory construction cost and corresponding growth, from 1991 to 2003, the factory construction cost increased 3.5 to $2.3 billion. Due to the manufacturing cost rise, many IDM company more and more tend to chip manufacturing business outsourcing to foundry, by 2006, wafer foundry home from IDM business has accounted for 32% of all business.

Historically, integrated circuit manufacturers business model is the evolution of gradually. In the 1960 s, the integrated circuit manufacturers collection design, the manufacture, the sale in a body, and also process equipment manufacturing; In the 70 s, the emergence of a professional integrated circuit equipment manufacturing company; In the 80 s was born wafer foundry, focus on chip manufacturing; But in the 90 s are emerging IP design company. All these changes are and market and product cost closely related, the enterprise should not only a clear division of work, and to the close cooperation, can urge a decline in the cost of the whole.

China's integrated circuit industry is in accelerated after the world's advanced level in the process. In 2006, China's integrated circuit market size of $45.4 billion, more than the United States in the world, while China's integrated circuit industry sales income of more than 100 billion yuan RMB. At present, China's IC design enterprises has reached 500, among them 35 - fifty home use 0.18 micron and the following technology, 2006 years ago ten IC design company total sales reached 1.3 billion us dollars, up by 55% over the previous year. In the chip manufacturing, smic as a representative of wafer foundry enterprise 2006 market share has accounted for 12.9%, it is estimated that by 2015 will reach 15.8%.

Moonlight group, research and development center, deputy general manager of the YuGuoChong:

Reduce the packaging cost is of great significance

FengXiaoWei

Nowadays, the global integrated circuit market has entered the smooth growth, personal computers and other digital consumer products accounted for integrated circuit application market mainstream status. With the development of technology, consumers will naturally put forward higher requirement to the product: the function to be more complete, more small size, speed faster, the price should be more low. With the improvement of product complexity, integrated circuit packaging technology must to system level package (SiP) forward. It is commonly believed that single chip (SoC) system is to reduce the cost of chip the important means. In fact, SiP technology using mature encapsulation technology integrated various components for the system, can realize the complementary and SoC.

Integrated circuit technology progress has been following the "Moore's law", i.e., integrated circuit chip integration every eighteen months double. With the continuous improvement of the precision of the lithography, integrated circuit before production process (i.e. chip manufacturing) cost greatly reduced, and at the same time, the difficulty of the chip packages increase gradually, so the production process (i.e. chip package) cost gradually rise. When the characteristic size of 0.13 u m, packaging cost accounts for about 25% of the cost of device; When the feature size progress to 90 nm, packaging cost ratio rose to 30%; According to the speed development bottom go to, is expected to when the feature size down to 45 nm, the packaging cost will be more than the whole device cost half. Therefore, actively develop new packaging technology, reduce the packaging cost, to reduce the cost of integrated circuit products is of great significance.

In view of the integrated circuit packaging cost more and more high, now IDM manufacturers more tend to packaging business outsourcing to professional packaging manufacturer. It is predicted that by the year 2009, will be about 50% of the IDM manufacturer will its integrated circuit packaging business outsourcing. So, give professional integrated circuit packaging enterprise created a huge market space. On the other hand, some high-end integrated circuit packaging enterprise in addition to strengthening its packaging areas of business, but also start up downstream extension, such as moonlight, can provide for the customer including circuit design testing, wafer testing, chip testing, system assembly and test, wide range of services.

Reduce the integrated circuit packaging cost depends on packaging technology and production process of the breakthrough, the main point is: to improve efficiency in the use of base plate; Rely on industrial engineering to improve output rate per unit time (UPH) and the overall equipment efficiency (OEE); Investment in research and development of a new generation of production equipment; Use silicon intermediate layer to minimize Low - K chip size. In addition, we must emphasize that is, reduce the integrated circuit packaging cost not only packaging enterprise a task that requires and circuit design, chip manufacturing enterprise cooperation, so as to realize the win-win industrial enterprise at all levels.

Beijing industrial promotion board deputy director feng hai:

Perfect the construction of industry chain is the key to its development

LiangGongBing

Beijing electronic information industry structure has been realized by electronic terminal product assembly to the core technology research and development, basic components manufacture, changing from natural resources as the main input key to intelligence resources as the main input key change, from hardware to software development mainly manufacturing, integrated circuit design, the transformation of industrial standards.

From Beijing integrated circuit industry industry distribution, we can see the package test industry accounted for the proportion of Beijing of the integrated circuit industry dropped from 57% in 2003 to 32% in 2006. IC design industry maintained a sustained and rapid development of the situation, from 2003 yuan in 1.87 billion increased to 2006 yuan in 8 billion, as the Beijing integrated circuit industry, the largest contribution to link the proportion increase from 30% in 2003 to 42%. By smic Beijing 12 inches of the production line put into production, pulling, integrated circuit manufacturing industry sales revenue from 2003 yuan to 4.35 billion yuan, the growth of industry specific gravity from 9.6% in 2003 to 23% by 2006, Beijing integrated circuit industry become the fastest growth industry.

Integrated circuit design, at present, Beijing integrated circuit design total sales accounted for about a third of the national. Special equipment and materials development, "15" period, Beijing north microelectronics company organization and zhongke letter company is responsible for the national 863 integrated circuit key equipment major projects, the success develops eight inches 100 nm polycrystalline silicon etching machine and large Angle ion injection machine, realized our country high-end integrated circuit, the core equipment of zero breakthrough.

YouYan semiconductor company developed diameter 12 inches silicon single crystal polished section, formed a complete set of preparation of 12 inches silicon single crystal polished section technology, and to build the first to produce 10000 pieces of 12 inches silicon polished section pilot production line.

Beijing in the future electronic information industry development, will continue to go "high-end, high efficiency, high radiation" development path, the standards, software development, integrated circuit design in the position of the priority development, independent innovation, promote occupied the commanding heights of the whole regional competitive advantage. Secondly, to increase international cooperation efforts, continue to promote integrated circuit key equipment and materials industry development. Third, we need to encourage enterprises to use independent technology for more international capital, market, talent resource elements, through the extensive international cooperation, make the electronic information industry into the global competition environment. The fourth is to use of various channels to cultivate talents, build up talent competition mechanism. The fifth is to actively encourage enterprises to serve for the 2008 Olympics, the use of advanced electronic information technology, the concept of "science and technology Olympics" fully embody.

- electronic (China) co., LTD. LSI development department minister LiJun:

WUSB technology advantage lies in the high speed and low cost

LiangGongBing

WUSB (WirelessUSB) is a new type of short distance wireless communication technology, theoretically in short distances can be achieved and the current widely used USB2.0 the same data transmission speed. At present, most WUSB can reach up to 10 m transmission distance, the fastest can achieve and USB2.0 the same 480 MBPS rate.

As a kind of short distance wireless communication technology, and many competitors, WUSB technology with high speed, low cost, low power consumption of the significant characteristics. Such as current bluetooth Ver2.0 only the supreme 2 m ~ 3 MBPS transmission speed, WiFi (802.11) speed some, however, there is the high cost and power consumption big weakness. WUSB is not only faster, because use the UWB technology, transmitted power is only other communication technology noise level. Therefore also reached very high spectrum utilization, and other communication technology Shared the same band. Be worth what carry is, due to the advantages of UWB technology, in addition, the recent WUSB of concern Wireless1394, BlueToothV3.0, WirelessHDMI technology may construct in UWB technology.

WUSB has good market prospects. In 2007, there will be some products into the market, and then into the rapid growth. By 2010 and 2011 respectively forecast will be us $300 million and us $500 million of market share. Product form is concerned, the first to get into the market will mainly for PC after-sale market WUSBdongle and Hub and Card - BusCard, and then gradually into WUSB function built-in primary end products.

WUSB has broad market prospects, the more companies are developing WUSB chip. As WUSB promote group and WiMedia alliance member,, electronic company is one of the pioneer. At present, electronic has been in development for the host side of the primary WUSB products and suitable for terminal side of the WUSBHub product control chip, and is developing used in primary WUSB terminal product chip. D720170 and D720180 two chip has passed the USB - IF organization the authentication. - electronic are currently developing corresponding physical layer of RF chip, is expected to achieve 2009 contains WUSB agreement control and physical PHY processing functions of 1 chip change solutions.

In July 2007, USB - IF announced the four companies of 6 kinds of terminal products through a CWUSB product compatibility test the authentication, marking the formal WUSB era coming.

AnMou consulting (Shanghai) co., LTD. China sales vice President WuXiongAng:

The future mobile Internet computing technology requirements of high performance low power consumption

LiangGongBing

The electronic market, mobile phone with its popularizing rate more than 80% become interesting target, the rapid development of mobile phone technology has also brought the people to the mobile Internet computing expectations.

Mobile phone technology growth makes the intelligent mobile phones and laptop computers developers is now in the mobile computing platform in face to face competition. Intelligent mobile phone manufacturers to develop mobile computing platform can provide including office software, games, Internet, E-mail, are provided by the function of the computer, people will no longer need to carry heavy notebook computer, also need not worry about with the battery can only work 3 hours.

In fact, mobile Internet computing needs to support applications, has been in the existing phone have emerged, and maintained a rapid growth. According to the statistics and forecast, able to support Internet application of mobile phone will be 2006 department, increased to 2010 in 436 million, the annual growth rate of nearly 50%; Able to support multimedia functions of mobile phone will be from 2004 in 259 million to 2008 in 731 million growth of department, the average annual growth of 30%; To move Office applications such as mobile phone operation Office software, with an average annual growth rate will also be more than 41%.

According to the mobile Internet computing equipment application characteristics, people ask its must have four major characteristics: always interconnection, high performance low power consumption, multimedia application and good Internet browser technology. Always interconnection requirements mobile computing platform with a variety of wireless access technology; High performance low power consumption requires at least able to support Office software to support business applications, and achieve a day full functionality of the time, a few days of standby time. Multimedia applications for support such as music, television, video and game function; Good Internet browser technical requirements browser can support a variety of plug-ins, and other technology.

This requires the mobile computing platform have at least two key techniques: one is to have good power efficiency, can guarantee to provide longer mobile work time. The second is the mobile communication platform provides the function of online at any time. This has high performance, low power consumption, long working mobile computing platforms will eventually able to replace most of the notebook computer and have been used widely.

Along with the mobile Internet computing market growth, ARM (AnMou) company will continue to ensure that the key technology can meet our partners and their customer's increasing demand, so as to ensure mobile Internet computing platform rapid application and development.